Standardized and AI Enhanced FA Workflows
Standardized and AI Enhanced FA Workflows
Tuesday, November 1, 2022: 10:10 AM-12:10 PM
Exhibit Halls A & B - Industry Exchange (Pasadena Convention Center)
To overcome the permanently growing challenges in securing manufacturing yield, and high quality and reliability demands of microelectronic devices, novel approaches for even more effective failure analysis tools and workflows are required. Breakthroughs in machine and deep leaning based image and signal processing will improve the sensitivity of FA tools and provide enhanced solutions for highly efficient automatized defect localization and analysis. The efficiency of FA workflows can even more be improved by standardized solutions for hard- and software interfaces and universal sample holders. Especially the definition of new standards needs a broad input from both FA engineers and FA tool manufactures. New approaches and solutions of AI based failure analysis, standardized tool interfaces and improved integrated FA workflows will be discussed.
Agenda:
- Thomas Schweinboeck (Infineon): Standardized HW and SW interfaces: Requirements and applications for semiconductor Failure Analysis flows
- Libor Strakos (Thermo Fisher Scientific): Single platform workflows for physical FA
- Peter Hoffrogge(PVATepla )/Jozef Obona (Tescan Orsay): Benefits in efficiency and cost of ownership by standardized solutions for tool connections
- Gabriel Reichl/Heiko Stegmann (Zeiss): Concepts for advanced sample holder and data exchange interfaces
- Greg Moldovan (pointelectronic): Usecases and benefits for standardized image metadata
- Konstantin Shekotihin (AAU): Requirements on image and meta data quality for ML/AI applications
- Bernice Zee (AMD): Application of integrated workflows
- Discussion
10:10 AM
10:40 AM
See more of: Technical Program