Package and Physical Analysis Challenges Tutorial III

Monday, November 13, 2023: 4:00 PM-5:00 PM

104 A-B (Phoenix Convention Center)

Mrs. Sarah Wozny, Applied Materials

4:00 PM

An Introduction to the FIB (Focused Ion Beam) as a Microchip Circuit Edit Tool
Mr. Steven Herschbein, Independent Consultant; Dr. Shida Tan, Intel Corporation; Mr. Richard H. Livengood, Intel Corporation; Mr. Michael Wong, Thermo Fisher Scientific

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