Fast Laser Probing using Gigahertz Digitizer

Wednesday, October 30, 2024: 11:40 AM
The Pointe (Hilton San Diego Bayfront)
Mr. Winson Lua , Advanced Micro Devices - Singapore Pte Ltd, Singapore, Singapore
Dr. Venkat Ravikumar , Advanced Micro Devices - Singapore Pte Ltd, Singapore, Singapore
Ms. Angeline phoa , Advanced Micro Devices - Singapore Pte Ltd, Singapore, Singapore

Summary:

Laser probing (LP) has traditionally been used with high-bandwidth oscilloscopes to gather transistor toggling data, providing picosecond-level temporal accuracy. However, this method requires longer acquisition time, making it less favored compared to other fault isolation (FI) techniques. This paper presents an innovative approach to LP using a high-speed digitizer, which significantly reduces the overall LP cycle time. Practical use cases and recommendations for implementing this method are also discussed, highlighting the benefits of using high-speed digitizers in LP for fault isolation.
See more of: Die Level Fault Isolation
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