Fundamentals and Emerging Capabilities of 3D X-ray Microscopy for Semiconductor Advanced Package Failure Analysis
Fundamentals and Emerging Capabilities of 3D X-ray Microscopy for Semiconductor Advanced Package Failure Analysis
Monday, October 28, 2024: 2:20 PM
204 (Hilton San Diego Bayfront)
Summary:
Non-destructive analysis is essential for investigating root cause of failures in electronic devices. Scanning acoustic microscopy (SAM) and X-ray imaging are the primary techniques adopted in failure analysis workflows to understand the structural characteristics and flaws within IC packages, without needing to cut open or disassemble the sample. In recent years, the complexity of packages has driven the adoption of 3D X-ray microscopy (XRM) as an essential technique. This tutorial provides a quick overview of the complementary nature of SAM and X-ray, and then focuses on the practical applications for 3D X-ray microscopy applied to advanced packaging and electronic materials. After an overview of basic 3D X-ray imaging principles, several use cases will be shown for a variety of 3D X-ray imaging techniques including microCT, X-ray microscopy, laminography, and nanoscale 3D XRM. State of the art capability will be reviewed, including improvements and benefits realized by implementation of deep-learning artificial intelligence-based reconstruction techniques. Research efforts and future directions for 3D X-ray imaging will conclude the tutorial.
Non-destructive analysis is essential for investigating root cause of failures in electronic devices. Scanning acoustic microscopy (SAM) and X-ray imaging are the primary techniques adopted in failure analysis workflows to understand the structural characteristics and flaws within IC packages, without needing to cut open or disassemble the sample. In recent years, the complexity of packages has driven the adoption of 3D X-ray microscopy (XRM) as an essential technique. This tutorial provides a quick overview of the complementary nature of SAM and X-ray, and then focuses on the practical applications for 3D X-ray microscopy applied to advanced packaging and electronic materials. After an overview of basic 3D X-ray imaging principles, several use cases will be shown for a variety of 3D X-ray imaging techniques including microCT, X-ray microscopy, laminography, and nanoscale 3D XRM. State of the art capability will be reviewed, including improvements and benefits realized by implementation of deep-learning artificial intelligence-based reconstruction techniques. Research efforts and future directions for 3D X-ray imaging will conclude the tutorial.