Package and Physical Analysis Challenges II

Monday, October 28, 2024: 2:20 PM-3:20 PM
204 (Hilton San Diego Bayfront)
Dr. Cecile Bonifacio Fittz, E.A. Fischione Instruments, Inc. and Ms. Melissa Mullen, Thermo Fisher Scientific
2:20 PM
Fundamentals and Emerging Capabilities of 3D X-ray Microscopy for Semiconductor Advanced Package Failure Analysis
Ms. Cheryl Hartfield, MA, FASM, ZEISS Microscopy
See more of: Tutorial
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