50th International Symposium for Testing and Failure Analysis (October 28- November 1, 2024)
October 28 - November 1, 2024
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Mr. Chin-Chih Yeh
Macronix International Co., Ltd.
Hsin-Chu Taiwan 300
Papers:
Utilizing PFIB for preparing TEM lamellae tailored to high aspect ratio 3D NAND structures
