Ms. Chae Soo Kim

Process Integration, Engineer
Samsung
Gyeonggi-do Korea, Republic of (South) 445-330

Papers:

Application of Advanced Dynamic Photon Emission Microscopy with Programmable Tester for Functional Failure Analysis of DRAM Devices
The Advanced Failure Analysis methods based on Dynamic Hot Electron Analyzer and IDD3P Measurements for HKMG Sub-nm DRAM