52nd International Symposium for Testing and Failure Analysis (October 4-8, 2026)
October 4 - 8, 2026
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Non‑Destructive Metrology of PCBs and Advanced Packages Using 3D X‑ray Microscopy
Wednesday, October 7, 2026: 3:40 PM
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Student Poster Contest
See more of:
Student Poster Contest
