52nd International Symposium for Testing and Failure Analysis (October 4-8, 2026)
October 4 - 8, 2026
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Wen Qiu
Advanced Micro Devices (AMD)
Device Analysis Laboratory
Singapore Singapore
Papers:
A Lumped-Element Circuit Model for Improved Spatial Localization of Open Defects in RF Lock-in Thermography (RF-LiT)