Education Course: 2.5D, 3D, 3.5D advanced packaging techniques: design, process, manufactory, yield, reliability, and failure analysis (Registration Required)
Saturday, October 3, 2026: 8:30 AM-12:30 PM
Saturday, October 3, 2026 | 8:30 a.m. – 12:30 p.m.
Instructor:
Yan Li, MediaTek
Pricing
Member – $325
Member (Student) – $199
NonMember – $425
NonMember (Student) – $199
Advanced Packaging enables the heterogeneous integration of chiplets with die embedding and die stacking techniques, and provides maximum device performance with a much faster product development cycle. However, as the 2.5D, 3D, and 3.5D packages are getting more and more complicated, it brings numerous challenges in the design, material and process development, product manufactory, yield ramping, reliability risk assessment, fault isolation and failure analysis of new products within the short timeline.
This short course provides detailed illustration of the design, process, manufactory, yield, reliability, and failure analysis for 2.5D, 3D, and 3.5D advanced packages. An overview of the advanced packaging industry with detailed assembly process flow, including Cu Pillars, micro bumps, thermal compressive bonding (TCB), Hybrid bonding (HB), Redistribution Layer (RDL) Lithography, die embedding, testing, and Surface Mount Technology will be discussed. Current Industry focus and research trends will be highlighted. Reliability, fault isolation, and failure analysis of advanced packages will be elaborated.
Biography: Dr. Yan Li received her Ph.D. degree in Materials Science and Engineering from Northwestern University, U.S.A. in 2006, and her M.S and B.S degree in Physics from Peking University, China. After more than 17 years in Intel Arizona and 3 years in Samsung Advanced Packaging group in San Jose focusing on advanced packaging technology developments, she joined Media Tek USA as a Principal Engineer of Packaging Technology in 2026. Dr. Li has been an active member of Minerals Metals and Materials Society (TMS), Institute of Electrical and Electronics Engineers (IEEE), American Society for Metals (ASM), and Electronic Device Failure Analysis Society (EDFAS). She has been appointed as TMS and International Symposium for Testing and Failure Analysis (ISTFA) annual conference organizer since 2011, EDFAS board member since 2019, EDFAS vice president since 2024, IEEE Electronic Components and Technology Conference (ECTC) Applied Reliability sub-committee member since 2024, and ISTFA general Chair in 2024. Dr. Li has published numerous papers and patents in the microelectronic packaging area. She is an associate editor of “Microelectronics Reliability” and the co-editor of three semiconductor industry highly recognized books on 3D Microelectronic Packaging and Autonomous Vehicles.
