Technical Program

Saturday, October 3, 2026

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8:30 AM-12:30 PM


Education Course: 2.5D, 3D, 3.5D advanced packaging techniques: design, process, manufactory, yield, reliability, and failure analysis (Registration Required)

Education Course: Materials Science in Physical Failure Analyses for Root-cause Finding (Registration Required)

1:30 PM-5:30 PM


Education Course: Beam-Based Defect Localization (Registration Required)

Sunday, October 4, 2026

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7:00 AM-8:00 AM


Author's Coffee

10:00 AM-10:20 AM


Morning Refreshment Break

12:20 PM-1:30 PM


Lunch

3:30 PM-3:50 PM


Afternoon Refreshment Break

Monday, October 5, 2026

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7:00 AM-8:00 AM


Author's Coffee

7:30 AM-8:30 AM


Breakfast

8:30 AM-9:40 AM


Opening Session & EDFAS General Meeting

9:40 AM-10:30 AM


Best Paper Awards

10:30 AM-10:50 AM


Morning Refreshment Break

10:50 AM-12:30 PM


Emerging FA Techniques and Concepts
Session Chair: Mr. Kent Erington and Ms. Amrutha Sampath

12:30 PM-1:40 PM


Lunch

Women in Failure Analysis

1:40 PM-3:10 PM


IRFA Keynote

3:10 PM-3:30 PM


Afternoon Refreshment Break

3:30 PM-4:00 PM


IRFA Isolation Brainstorming

IRFA Package Brainstorming

IRFA Post Isolation Brainstorming

4:00 PM-5:00 PM


Integrated PFA User Group Discussion

OFI User Group Discussion

System in Package User Group Discussion

5:00 PM-5:15 PM


User Group Discussion Break

5:30 PM-7:30 PM


Tools of the Trade Tour

Tuesday, October 6, 2026

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7:00 AM-8:00 AM


Author's Coffee

8:30 AM-9:30 AM


ISTFA Keynote

9:30 AM-10:10 AM


Morning Refreshment Break

9:30 AM-6:00 PM


Exhibit Open Hours

10:10 AM-11:00 AM


AI Applications for Failure Analysis I
Session Chair: Dr. Sebastian Brand and Zachary Eich

Design for Analysis, Test and Diagnostics
Session Chair: Jayant D'Souza and Arpan Bhattacherjee

Nanoprobing & Electrical Characterization
Session Chair: Dave Albert and Mr. John Sanders

12:50 PM-1:50 PM


Sample Prep User Group Discussion

12:50 PM-2:50 PM


AI Applications for Failure Analysis II

Device Analysis - Case Studies I
Session Chair: Mr. Greg Johnson and Dr. Yuyan Wang

1:50 PM-2:50 PM


FIB User Group Discussion

2:50 PM-3:20 PM


Afternoon Refreshment Break

3:20 PM-3:40 PM


Device Analysis - Case Studies II

3:20 PM-4:00 PM


AI Applications for Failure Analysis III

3:20 PM-5:00 PM


Scanning Probe Analysis
Session Chair: Mr. Philip Kaszuba, FASM and Dr. Daminda Dahanayaka

3:40 PM-4:00 PM


More than Moore: Integrating New Functions into Nano-Electronics
Session Chair: Dr. Ricky Anthony and Dr. William Lo

4:00 PM-5:00 PM


AI User Group Discussion

5:00 PM-6:30 PM


Welcome Reception with the Exhibitors

Wednesday, October 7, 2026

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7:00 AM-8:00 AM


Author's Coffee

8:00 AM-9:40 AM


Die Level Fault Isolation I
Session Chair: Ms. Lesly Endrinal and Mr. Dan Bodoh

FA Process: Fault Isolation, Mechanisms & Solutions I
Session Chair: Vinod Narang and Rosalinda Ring

9:00 AM-9:40 AM


Package Level Fault Isolation I
Session Chair: Sylvia Lewis and Ms. Susan Li

9:00 AM-4:00 PM


Exhibit Open Hours

9:40 AM-10:00 AM


Morning Refreshment Break

10:00 AM-10:20 AM


Die Level Fault Isolation II

10:00 AM-11:40 AM


FA Process: Fault Isolation, Mechanisms & Solutions II

Package Level Fault Isolation II

10:40 AM-11:40 AM


Nanoprobing/SPM User Group Discussion

11:40 AM-1:10 PM


Capital Equipment Forum

Lunch on the Expo Floor

Student Young Professionals

1:10 PM-1:30 PM


Afternoon Refreshment Break

1:30 PM-3:00 PM


Panel Discussion

3:00 PM-4:00 PM


Poster Session

4:00 PM-4:20 PM


FA at the Next Level, Boards and Systems
Session Chair: Bernice Zee and Mr. Huei Hao Yap

4:00 PM-5:20 PM


Hardware Security and Counterfeiting
Session Chair: Kevin Awai and Ms. Pamela Calica

4:20 PM-5:00 PM


Power Devices (Si, SiC, GaN)
Session Chair: Dr. Christopher H. Kang and Prof. Rosine COQ GERMANICUS

5:00 PM-5:30 PM


Student Young Professionals Discussion

7:00 PM-9:30 PM


Social Networking Event

Thursday, October 8, 2026

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7:00 AM-8:00 AM


Author's Coffee

8:00 AM-10:00 AM


Microscopy Analysis and Material Characterization I
Session Chair: Dr. Cecile S. Bonifacio and Mr. Tom Schamp

8:00 AM-10:20 AM


Sample Preparation and Device De-processing
Session Chair: Dr. Pawel Nowakowski and Mr. Jon Scholl

10:00 AM-10:20 AM


Morning Refreshment Break

10:20 AM-11:20 AM


Microscopy Analysis and Material Characterization II

10:20 AM-12:00 PM


FIB Sample Preparation & Circuit Edit
Session Chair: Dr. Cathy Vartuli and Mr. Antonio Tollis

10:20 AM-12:20 PM


System in Package and 3D Devices
Session Chair: Mr. Neel Leslie and Mr. Hemachandar Tanukonda Devarajulu