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| Packaging 1 | ||||
| Location: Meeting Room C/D (Worcester's Centrum Centre) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Editors: | Mr. David Vallett IBM Systems and Technology Group, Essex Jct., VT Dr. William Vanderlinde Laboratory for Physical Sciences, College Park, MD | |||
| Session Chairs: | Ms. Becky Holdford Texas Instruments, Dallas, TX Mr. Kendall Scott Wills Independent Consultant, Sugar Land, TX | |||
| 8:15 AM | Failure Analysis Challenges for Chip Scale Packages | |||
| 9:00 AM | X-ray & SAM Challenges for IC Package Inspection | |||
| 9:45 AM | FA Using Time Domain Reflectometry Measurements | |||
| 10:30 AM | Break | |||
| 10:45 AM | Stacked Die Repackaging And Failure Analysis | |||