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| Session 1: Advanced Techniques 1 | ||||
| Location: Ballroom A (Renaissance Austin Hotel) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Advanced Techniques 1: The Advanced Techniques session offers a wide variety of papers on numerous aspects of IC and MEMS analysis, including: a microwave technique for characterizing low-k dielectrics, phonon detection in MEMS, and magnetic current imaging using MTJs. Advanced Techniques 2: The second session features e-beam probing in backside FIB trenches, adaptation of a solid immersion lens for thermal imaging, indirect ESD stressing, a new planar deprocessing method, and an advanced reverse engineering process. | ||||
| Editor: | Rajen Dias Intel Corporation, Chandler, AZ | |||
| Session Chairs: | Dr. Rajen Dias Intel Corporation, Chandler, AZ Dr. Benaiah D. Schrag Micro Magnetics, Inc., Fall River, MA | |||
| 10:15 AM | Near-Field Scanning Microwave Probe for Rapid Detection of Non-Visual and Parametric Defects in Cu/Low-K Interconnect on Production Wafers | |||
| 10:40 AM | Non-Invasive Acoustic Phonon Characterization of Dynamic MEMS | |||
| 11:05 AM | Magnetic Current Imaging with Magnetic Tunnel Junction Sensors: Case Study and Analysis | |||