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The 35th International Symposium for Testing and Failure Analysis (November 15-19, 2009) of ASM |
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| Session 11: Advanced Metrology and System Level FA | ||||
| Location: Meeting Room J3 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: The System Level Analysis session is dedicated to analysis of failures and materials used in the board assembly and board level operation of electronic systems. | ||||
| Session Chairs: | Mr. Apek Mulay Texas Instruments, TX Mr. David Burgess Accelerated Analysis, Half Moon Bay, CA Dr. James J. Demarest IBM, Albany, NY Dr. Sam Subramanian Freescale Semiconductor, Inc., Austin, TX | |||
| 10:15 AM | Start up and Evolution of a FEI DA 300 DBFIB for Automatic STEM Sample Preparation | |||
| 10:40 AM | The Helium Ion Microscope for High Resolution Imaging, Materials Analysis, Circuit Edit and FA Applications | |||
| 11:05 AM | Damage Induced Field Failures of Electrical Contacts | |||