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| Session 5: Defect Characterization & Metrology - I | ||||
| Location: Malachite Showroom (InterContinental Hotel Dallas) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chairs: | Mr. Phil Kaszuba IBM Microelectronics, Essex Junction, VT Mr. Terence Kane IBM, Hopewell Junction, NY | |||
| 4:05 PM | 5.1 | Backscattered Electron Imaging for Embedded Subtle Defects in 32nm Processes | ||
| 4:30 PM | 5.2 | Semi-Automated Full Wafer in-Line SRAM Failure Analysis by Dual Beam Focused Ion Beam (FIB) | ||
| 4:55 PM | 5.3 | Simulation Studies of Fluorine-Induced Corrosion and Defects On Microchip Al Bondpads in Wafer Fabrication | ||