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| Technology-Specific Failure Analysis | ||||
| Location: Malachite Showroom (InterContinental Hotel Dallas) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Failure analysts share a common toolset and common techniques. Some individual technologies, however, have developed techniques that take advantage of the unique structure or materials of the technology. In the Technology-Specific FA track, we discuss the failure analysis of photovoltaics, memories, micro-electromechanical systems (MEMS), analog circuits, and certain process technologies. | ||||
| Session Chairs: | Mr. Dan J. Bodoh Freescale Semiconductor, Austin, TX Dr. Sam Subramanian Freescale Semiconductor, Inc., Austin, TX | |||
| 8:15 AM | Counterfeit Electronics | |||
| 10:15 AM | Refreshment Break | |||
| 10:30 AM | Surface ESD (ESDFOS) in Assembly Fab Machineries as a Functional and Reliability Risk - Failure Analysis, Tool Diagnosis and On-Site-Remedies | |||
| 11:45 AM | Lunch | |||
| 1:00 PM | The Role of Nano-Probing in Yield and Failure Analysis | |||
| 2:00 PM | Failure Analysis of Non-Volatile Memory | |||
| 3:00 PM | Refreshment Break | |||
| 3:15 PM | Failure Analysis and Defect Localization in DRAM Devices | |||
| 4:15 PM | Failure Analysis of SRAM Devices | |||