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| Die and Defect Access | ||||
| Location: Lalique I (InterContinental Hotel Dallas) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Manufacturing a chip requires weeks, and a failure analyst can take the chip apart in minutes. But given constraints of functionality or imaging, deconstruction requires more thought and effort. The Die and Defect Access Track shows us techniques for opening complex packages and delayering the die. | ||||
| Session Chair: | Mr. Chris Richardson Abound Solar, Fort Collins, CO | |||
| 1:00 PM | Flip Chip and Backside Analysis Techniques | |||
| 2:15 PM | Refreshment Break | |||
| 2:30 PM | Delayering Techniques | |||
| 4:00 PM | Enhanced De-Packaging and Chip Access | |||
| 5:00 PM | Chip-Scale Packages and Their Failure Analysis Challenges | |||