Multi-Site Full Thickness Backside Focused Ion Beam (FIB) Editing for eDRAM Array Address Descramble Verification

Thursday, November 15, 2012: 1:20 PM

102AB (Phoenix Convention Center)

Mr. Steven B. Herschbein , IBM Systems & Technology, Hopewell Junction, NY

Mr. Carmelo F. Scrudato , IBM Systems & Technology, Hopewell Junction, NY

Mr. George K. Worth , IBM Systems & Technology, Hopewell Junction, NY

Mr. Edward S. Hermann , IBM Systems & Technology, Hopewell Junction, NY

22.2 Multi-Site Full Thickness Backside Focused Ion Beam (FIB) Editing for eDRAM Array Address Descramble Verification