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4.3
Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies
Monday, November 12, 2012: 4:10 PM
101AB (Phoenix Convention Center)
Dr. Peter Czurratis
,
PVA TePla Analytical Systems GmbH, Westhausen, Germany
Peter Hoffrogge
,
PVA TePla Analytical Systems GmbH, Westhausen, Germany
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Session 4: Fault Isolation and Failure Analysis of 3D Packages
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Symposium
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