Session 4: Fault Isolation and Failure Analysis of 3D Packages

Monday, November 12, 2012: 3:20 PM-4:35 PM

101AB (Phoenix Convention Center)

Session Chairs:

Ms. Yan Li and Mr. Rudolf Schlangen

3:20 PM

Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in Packages
Mr. Christian Schmidt, Fraunhofer Institute for Mechanics of Materials; Frank Altmann, Fraunhofer Institute for Mechanics of Materials; Mr. David Vallett, IBM Systems and Technology Group

3:45 PM

Non Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography
Dr. Yan Li, Intel; Yongming Cai, Intel; Mario Pacheco, Intel; Rajen C Dias, Intel; Deepak Goyal, Intel

4:10 PM

Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies
Dr. Peter Czurratis, PVA TePla Analytical Systems GmbH; Peter Hoffrogge, PVA TePla Analytical Systems GmbH

See more of: Symposium

4 Session 4: Fault Isolation and Failure Analysis of 3D Packages