Start | At-A-Glance | Browse by Day | Author Index

2.2 Microstructural Considerations On the Reliability of 3D Packaging

Monday, November 12, 2012: 1:50 PM
101AB (Phoenix Convention Center)
Dr. Zhiheng Huang , Sun Yat-sen University, Guangzhou, China
Zhiyong Wu , Sun Yat-sen University, Guangzhou, China
Hua Xiong , Sun Yat-sen University, Guangzhou, China
Yucheng Ma , Sun Yat-sen University, Guangzhou, China
See more of: Session 2: Fault Isolation and Failure Analysis of TSV
See more of: Symposium