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2 Session 2: Fault Isolation and Failure Analysis of TSV

Monday, November 12, 2012: 1:25 PM-3:05 PM
101AB (Phoenix Convention Center)
Session Chairs:
Dr. Yan Li and Mr. Rudolf Schlangen
1:25 PM
2.1
Cross Section Analysis of Cu filled TSVs based on High Throughput Plasma-FIB Milling
Mr. Jens Beyersdorfer, Fraunhofer Institute for Mechanics of Materials; Mr. Frank Altmann, Fraunhofer Institute for Mechanics of Materials; Jan Schischka, Fraunhofer Institute for Mechanics of Materials; Michael Krause, Fraunhofer Institute for Mechanics of Materials; Mr. German Franz, FEI Europe B.V.; Laurens Kwakman, FEI Europe B.V.
1:50 PM
2.2
Microstructural Considerations On the Reliability of 3D Packaging
Dr. Zhiheng Huang, Sun Yat-sen University; Zhiyong Wu, Sun Yat-sen University; Hua Xiong, Sun Yat-sen University; Yucheng Ma, Sun Yat-sen University
2:15 PM
2.3
High-frequency TSV Failure Detection Method with Z Parameter
Ms. Joohee Kim, KAIST; Daniel Jung, KAIST; Jonghyun Cho, KAIST; Jun So Pak, KAIST; Joungho Kim, KAIST; Dr. Jong Min Yook, KETI; Jun Chul Kim, KETI
2:40 PM
2.4
Enhanced Failure Analysis on Open TSV Interconnects
Mr. Frank Altmann, Fraunhofer Institute for Mechanics of Materials; Christian Schmidt, Fraunhofer Institute for Mechanics of Materials; Jens Beyersdorfer, Fraunhofer Institute for Mechanics of Materials; Michél Simon-Najasek, Fraunhofer Institute for Mechanics of Materials; Christian Große, Fraunhofer Institute for Mechanics of Materials; Frank Schrank, austriamicrosystems AG; Jochen Kraft, austriamicrosystems AG
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