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14.1 Fluorosilicate Glass (FSG) Outgassing Induced Aluminum Bond Pad Corrosion During Post-Fab Wafer Storage

Wednesday, November 14, 2012: 8:00 AM
102AB (Phoenix Convention Center)
Dr. Binghai Liu , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Dr. Younan Hua , GLOBALFOUNDRIES Singapore, Singapore, Singapore
Nistala Ramesh Rao , GLOBALFOUNDRIES Singapore, Singapore, Singapore
Shuting Chen , GLOBALFOUNDRIES Singapore, Singapore, Singapore
See more of: Session 14: Packaging and Assembly Analysis
See more of: Symposium