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14 Session 14: Packaging and Assembly Analysis

Wednesday, November 14, 2012: 8:00 AM-10:05 AM
102AB (Phoenix Convention Center)
Session Chairs:
Ms. Becky Holdford and Mr. Robert Champaign
8:00 AM
14.1
Fluorosilicate Glass (FSG) Outgassing Induced Aluminum Bond Pad Corrosion During Post-Fab Wafer Storage
Dr. Binghai Liu, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Younan Hua, GLOBALFOUNDRIES Singapore; Nistala Ramesh Rao, GLOBALFOUNDRIES Singapore; Shuting Chen, GLOBALFOUNDRIES Singapore
8:25 AM
14.2
An Overview of Cu Wire Intermetallic Compound Formation and a Corrosion Failure Mechanism
Dr. Dongmei Meng, LSI Corporation; Laura Buck, LSI Corporation; Mr. Jim Cargo, LSI Corporation
8:50 AM
14.3
Lock-In Thermography for Flip Chip Package Failure Analysis
Dr. Lihong Cao, Advanced Micro Devices; Manasa Venkata, Advanced Micro Devices; Jeffery Huynh, Advanced Micro Devices; Joseph Tan, Advanced Micro Devices; Mengyeow Tay, Advanced Micro Devices; Mr. Rudolf Schlangen, DCG Systems; Kannu Wadhwa, DCG Systems
9:15 AM
14.4
Dynamic Impact Package Characterization
Mr. Jake E. Klein, Texas Instruments
9:40 AM
14.5
Development of Advanced Nondestructive Techniques for Failure Analysis of PCBs and PCBAs
Mr. Julien Perraud, Thales Research and Technology; Mr. Arnaud Grivon, THALES GLOBAL SERVICES; Dr. Shaïma Enouz-Vedrenne, Thales Research and Technology; Mr. Jean-Claude Clement, Thales Research and Technology
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