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2.1 Cross Section Analysis of Cu filled TSVs based on High Throughput Plasma-FIB Milling

Monday, November 12, 2012: 1:25 PM
101AB (Phoenix Convention Center)
Mr. Jens Beyersdorfer , Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Mr. Frank Altmann , Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Jan Schischka , Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Michael Krause , Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Mr. German Franz , FEI Europe B.V., Eindhoven, Netherlands
Laurens Kwakman , FEI Europe B.V., Eindhoven, Netherlands
See more of: Session 2: Fault Isolation and Failure Analysis of TSV
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