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4.2 Non Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography

Monday, November 12, 2012: 3:45 PM
101AB (Phoenix Convention Center)
Dr. Yan Li , Intel, Chandler, AZ
Yongming Cai , Intel, Chandler, AZ
Mario Pacheco , Intel, Chandler, AZ
Rajen C Dias , Intel, Chandler, AZ
Deepak Goyal , Intel, Chandler, AZ
See more of: Session 4: Fault Isolation and Failure Analysis of 3D Packages
See more of: Symposium