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14.3 Lock-In Thermography for Flip Chip Package Failure Analysis

Wednesday, November 14, 2012: 8:50 AM
102AB (Phoenix Convention Center)
Dr. Lihong Cao , Advanced Micro Devices, Austin, TX
Manasa Venkata , Advanced Micro Devices, Austin, TX
Jeffery Huynh , Advanced Micro Devices, Austin, TX
Joseph Tan , Advanced Micro Devices, Austin, TX
Mengyeow Tay , Advanced Micro Devices, Austin, TX
Mr. Rudolf Schlangen , DCG Systems, Fremont, CA
Kannu Wadhwa , DCG Systems, Fremont, CA
See more of: Session 14: Packaging and Assembly Analysis
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