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22.1 Preparation of Wafer Level Packaged Integrated Circuits using Pulsed Laser Assisted Chemical Etching

Thursday, November 15, 2012: 12:55 PM
102AB (Phoenix Convention Center)
Dr. Robert D. Chivas , Varioscale, Inc, San Marcos, CA
Dr. Niru Dandekar , Varioscale, Inc, San Marcos, CA
Scott Silverman , Varioscale, Inc, San Marcos, CA
Mr. Michael DiBattista , Qualcomm, Inc, San Diego, CA
Roddy Cruz , Qualcomm, Inc, SAN DIEGO, CA
See more of: Session 22: Circuit Edit: Processing Strategies
See more of: Symposium