High-Throughput, Site-Specific TEM Sample Preparation of Sub-20nm Thick Lamella for Process Metrology and Failure Analysis

Wednesday, November 14, 2012: 4:45 PM

101AB (Phoenix Convention Center)

Mr. Roger Alvis , FEI Company, Hillsboro, OR

Jeff Blackwood , FEI Company, Hillsboro, OR

Sang-Hoon Lee , FEI Company, Hillsboro, OR

Mr. Matthew Bray , FEI Company, Hillsboro, OR

17.4 High-Throughput, Site-Specific TEM Sample Preparation of Sub-20nm Thick Lamella for Process Metrology and Failure Analysis