Advanced Fault Isolation Technique using Electro Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip chip package

Monday, November 12, 2012: 11:10 AM

101AB (Phoenix Convention Center)

Dr. Lihong Cao , Advanced Micro Devices, Austin, TX

Manasa Venkata , Advanced Micro Devices, Austin, TX

Meng Yeow Tay , Advanced Micro Devices, Singapore, Singapore

Wen Qiu , Advanced Micro Devices, Singapore, Singapore

J. Alton , TeraView Limited, Cambridge, United Kingdom

P. Taday , TeraView Limited, Cambridge, United Kingdom

1.4 Advanced Fault Isolation Technique using Electro Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip chip package