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9.1 Advanced Physical Analysis Methodologies for Yield and Reliability of 28-nm, Bulk-Si, Flip-Chip ICs using SEM and Backside Deprocessing

Tuesday, November 13, 2012: 9:55 AM
102AB (Phoenix Convention Center)
Dr. Yuanjing (Jane) Li , nVIDIA Corporation, Santa Clara, CA
Steven Scott , nVIDIA Corporation, Santa Clara, CA
Howard Lee Marks , nVIDIA Corporation, Santa Clara, CA
See more of: Session 9: Technology Specific Case Studies
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