9 Session 9: Technology Specific Case Studies

Tuesday, November 13, 2012: 9:55 AM-11:35 AM
102AB (Phoenix Convention Center)
Session Chairs:
Ms. Rose Ring and Mr. David L. Burgess
9:55 AM
Advanced Physical Analysis Methodologies for Yield and Reliability of 28-nm, Bulk-Si, Flip-Chip ICs using SEM and Backside Deprocessing
Dr. Yuanjing (Jane) Li, nVIDIA Corporation; Steven Scott, nVIDIA Corporation; Howard Lee Marks, nVIDIA Corporation
10:20 AM
A Comprehensive Failure Analysis Metrology and Mechanism Study on Ultra-low-k Film Adhesion Failure
Dr. Shuting Chen, GLOBALFOUNDRIES Singapore Pte Ltd; Lei Zhu, GLOBALFOUNDRIES Singapore Pte Ltd; Han Wei Teo, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Binghai Liu, GLOBALFOUNDRIES Singapore Pte Ltd; Yanhua Huang, GLOBALFOUNDRIES Singapore Pte Ltd; Kian Kok, Kenny Ong, GLOBALFOUNDRIES Singapore Pte Ltd; Zhiqiang Mo, GLOBALFOUNDRIES Singapore Pte Ltd; Younan Hua, GLOBALFOUNDRIES Singapore Pte Ltd; Zhaoxin Yuan, GLOBALFOUNDRIES Singapore Pte Ltd; Yong Seng Heng, GLOBALFOUNDRIES Singapore Pte Ltd; Chao Yong Li, GLOBALFOUNDRIES Singapore Pte Ltd
10:45 AM
Systematic Approach for the Gate Oxide Failure Caused by Arsenic Cross Contamination
Dr. Lei Zhu, Globalfoundries Singapore Pte. Ltd.; Huipeng Ng, Globalfoundries Singapore Pte. Ltd.; Yanhua Huang, Globalfoundries Singapore Pte. Ltd.; Han Wei Teo, Globalfoundries Singapore Pte. Ltd.; Kenny Ong, Globalfoundries Singapore Pte. Ltd.; Shuting Chen, Globalfoundries Singapore Pte. Ltd.; Changqing Chen, Globalfoundries Singapore Pte. Ltd.; Ghim Boon Ang, Globalfoundries Singapore Pte. Ltd.; You Nan Hua, Globalfoundries Singapore Pte. Ltd.; Zheng Li, Globalfoundries Singapore Pte. Ltd.
11:10 AM
Failure Analysis on Integrated Power Devices
Dr. Arthur Chiang, Vishay Siliconix; Dr. Huixian Wu, Vishay Siliconix; David Le, Vishay Siliconix
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