Package and Physical Analysis Challenges I

Keyes, Ed

Sunday, November 11, 2012: 8:00 AM-11:00 AM

101B (Phoenix Convention Center)

Session Chairs:

Mr. Ed Keyes and Mr. Christopher A. Pawlowicz

8:00 AM

Packaging Failure Analysis
Ms. Becky Holdford, Texas Instruments, Inc.

9:00 AM

X-Ray and SAM Challenges for IC Package Inspection
Dr. Thomas M. Moore, Omniprobe, Inc.; Cheryl Hartfield, Omniprobe, Inc.; Mrs. Gay Samuelson, Translational Genomic Institute

10:00 AM

Chip Scale Package and Its Failure Analysis Challenges
Ms. Susan Li, Spansion Inc

11:00 AM

Lunch

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