6.1
Electro Optical Terahertz Pulse Reflectometry - a Fast and Highly Accurate Non-Destructive Fault Isolation Technique for 3D Flip Chip Packages

Tuesday, November 5, 2013: 9:30 AM
Meeting Room 230B (San Jose McEnery Convention Center)
Mr. Stephane Barbeau , IBM Microelectronics, Bromont, QC, Canada
Dr. J. Alton , TeraView Limited, Cambridge, United Kingdom
Mr. Martin Igarashi , TeraView Limited, Cambridge, United Kingdom

See more of: Session 6: Packaging and Assembly Analysis - 1
See more of: Symposium