Symposium

Monday, November 4, 2013

8:00 AM-9:45 AM

10:00 AM-12:05 PM


1
Session 1: Emerging Concepts and Techniques
Session Chair: Dr. Michael Bruce and Dr. Huimeng Wu

1:05 PM-2:45 PM


2
Session 2: 3D Packages
Session Chair: Mr. Frank Altmann and Dr. Yan Li

3
Session 3: Test and Diagnostics
Session Chair: Mr. Geir Eide and Mr. Mark E. Kimball

3:00 PM-4:15 PM


4
Session 4: Circuit Edit
Session Chair: Mr. Dane Scott and Dr. Michael DiBattista

4:00 PM-5:00 PM

7:00 PM-9:30 PM


10
Session 10: Posters
Session Chair: Mr. David Grosjean and Mr. Christian Burmer

Tuesday, November 5, 2013

8:15 AM-9:15 AM

9:30 AM-11:35 AM


6
Session 6: Packaging and Assembly Analysis - 1
Session Chair: Ms. Becky Holdford and Dr. Lihong Cao

9:30 AM-4:15 PM


5
Session 5: Case Studies and the Failure Analysis Process
Session Chair: Ms. Rose Ring and Mr. David L. Burgess

1:05 PM-4:15 PM


7
Session 7: Defect Characterization and Metrology
Session Chair: Mr. Phil Kaszuba and Mr. Terence Kane

6:00 PM-8:00 PM

Wednesday, November 6, 2013

9:00 AM-4:20 PM


8
Session 8: Sample Preparation and Device Deprocessing - 1
Session Chair: Mr. Bryan Tracy and Mr. Roger Alvis

9:00 AM-5:10 PM


9
Session 9: Photon Based Techniques - 1
Session Chair: Dr. Frank Zachariasse and Dr. Herve Deslandes

1:30 PM-3:30 PM


10
Session 10: Posters
Session Chair: Mr. David Grosjean and Mr. Christian Burmer

4:45 PM-6:45 PM

5:30 PM-7:30 PM

Thursday, November 7, 2013

9:00 AM-3:50 PM


11
Session 11: Nanoprobing and Nanoscale Electrical Failure Analysis
Session Chair: Mr. John Sanders and Mr. Andy Erickson

10:05 AM-11:45 AM


12
Session 12: Photon Based Techniques - 2
Session Chair: Dr. Frank Zachariasse and Dr. Herve Deslandes

1:05 PM-2:20 PM


13
Session 13: Sample Preparation and Device Deprocessing - 2
Session Chair: Mr. Bryan Tracy and Mr. Roger Alvis

3:00 PM-4:15 PM


14
Session 14: Packaging and Assembly Analysis - 2
Session Chair: Ms. Becky Holdford and Dr. Lihong Cao

4:30 PM-6:30 PM