6
Session 6: Packaging and Assembly Analysis - 1

Tuesday, November 5, 2013: 9:30 AM-11:35 AM
Meeting Room 230B (San Jose McEnery Convention Center)
Session Chairs:
Ms. Becky Holdford and Dr. Lihong Cao
9:30 AM
6.1
Electro Optical Terahertz Pulse Reflectometry - a Fast and Highly Accurate Non-Destructive Fault Isolation Technique for 3D Flip Chip Packages
Mr. Stephane Barbeau, IBM Microelectronics; Dr. J. Alton, TeraView Limited; Mr. Martin Igarashi, TeraView Limited
9:55 AM
6.2
Open Localization in Micro Leadframe Package Using Space Domain Reflectometry
Mr. Jan Gaudestad, Neocera LLC; Dr. Antonio Orozco, Neocera; Dr. Vladimir Talanov, Neocera Inc; Mr. Maxime Marchetti, ST Microelectronics
10:20 AM
6.3
Nondestructive Analysis Solution Using Combination of Lock-in Thermography(LIT) and Advanced 3D Oblique X-Ray CT Technology
Mr. Naoki Seimiya, Marubun Corporation
10:45 AM
6.4
Sub-Mohms Resistance Characterization of Conductive Interfaces On Automotive Power Mosfet to Determine the Origin of On-Resistance Drift
Dr. Yann Weber, Freescale Semiconducteurs France SAS; Philippe Rousseille, Freescale Semiconductor
11:10 AM
6.5
Analysis of Power Mosfet High Current Temperature Cycling Failures
Mr. I Kearney, MEngSc / BE, Texas Instruments
See more of: Symposium
<< Previous Session | Next Session >>