13.3
Alternative Sample Preparation Technique for Die Level Parallel Lapping Analysis

Thursday, November 7, 2013: 1:55 PM
Meeting Room 230B (San Jose McEnery Convention Center)
Mr. Hoonyen Gwee , Infineon Technologies, Melaka, Malaysia

Summary:

An alternative way of sample preparation technique being proposed to overcome weakness/obstacles done by traditional preparation method for parallel lapping analysis. This new proposed sample preparation methodology is relatively fast and simple.