14.1
Planar Analysis of Copper-Aluminium Intermetallics

Thursday, November 7, 2013: 3:00 PM
Meeting Room 230B (San Jose McEnery Convention Center)
Dr. Frank Zachariasse , NXP Semiconductors, Nijmegen, Netherlands
Dr. G.M. O'Halloran , NXP Semiconductors, Nijmegen, Netherlands
Dr. Arjan van IJzerloo , NXP Semiconductors, Nijmegen, Netherlands
Dr. Rene Rongen , NXP Semiconductors, Nijmegen, Netherlands

Summary:

We present a fast and accurate measurement system that can be used to evaluate both the zero-hour quality of the Cu-Al contact as well accurately measure as the degradation of the contact after reliability testing.
See more of: Session 14: Packaging and Assembly Analysis - 2
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