14
Session 14: Packaging and Assembly Analysis - 2

Thursday, November 7, 2013: 3:00 PM-4:15 PM
Meeting Room 230B (San Jose McEnery Convention Center)
Session Chairs:
Ms. Becky Holdford and Dr. Lihong Cao
3:00 PM
14.1
Planar Analysis of Copper-Aluminium Intermetallics
Dr. Frank Zachariasse, NXP Semiconductors; Dr. G.M. O'Halloran, NXP Semiconductors; Dr. Arjan van IJzerloo, NXP Semiconductors; Dr. Rene Rongen, NXP Semiconductors
3:25 PM
14.2
A Comprehensive FA Approach to Lifted Bond Balls Package Failure
Mr. Dat Nguyen, Texas Instruments Corporation; Mr. Sagar Karki, Texas Instruments Corporation
3:50 PM
14.3
Failure Analysis On Lifted Ball Bond and Micro Lateral Crack Using Fractography Approach
Mr. Foo Khong Yong, -, Infineon Technologies (Kulim) Sdn. Bhd.; Mr. Michael Raj Marks, -, Infineon Technologies (Kulim) Sdn. Bhd.
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