Advanced FIB Application: Automatically Precision Deprocessing in Failure Analysis

Summary:

FIB has demonstrated the widespread utilization in semiconductor industry such as TEM sample preparation, circuit edit. In this paper, we systematically introduced an important application of the FIB milling for automatically precision polishing on the wafer level failure analysis. The schematic of the gas-assisted FIB etching is shown in Figure 1. By utilizing FIB milling method, it demonstrates that we can conduct the precise localized milling, take image with desired region immediately and cut the die directly on the exact interested failure location. Furthermore, it is straightforward to specifically choose the size of the milling area without damage of other parts on the specimen. Importantly, such FIB milling method enables to save at least one third of the polishing time. We believe this method paves the way to provide a novel side of the FIB technique and polishing method.