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Session 8: Sample Preparation and Device Deprocessing - 1

Wednesday, November 6, 2013: 9:00 AM-4:20 PM
Meeting Room 230A (San Jose McEnery Convention Center)
Session Chairs:
Mr. Bryan Tracy and Mr. Roger Alvis
9:00 AM
8.1
Advanced FIB Application: Automatically Precision Deprocessing in Failure Analysis
Dr. Dandan Wang, GLOBALFOUNDRIES Singapore Pte. Ltd; Mr. Hua Feng, GLOBALFOUNDRIES Singapore Pte. Ltd; Mr. P.K. Tan, Globalfoundries Singapore Pte. Ltd.; G.R. Low, Globalfoundries Singapore Pte. Ltd.; Mr. C.K. Oh, Globalfoundries Singapore Pte. Ltd.; Jeffrey Lam, Globalfoundries Singapore Pte. Ltd.; Dr. Z.H. Mai, Globalfoundries Singapore Pte. Ltd.; Mr. Raghaw Rai, GLOBALFOUNDRIES Singapore Pte Ltd
9:25 AM
8.2
Backside Deprocessing for Bulk Silicon Devices
Mr. Maozhe Samuel Wei, Advanced Micro Devices (Singapore) Pte Ltd; Ms. Lauren Blair, Advanced Micro Devices Ptd Ltd
9:50 AM
Break
10:05 AM
8.3
Silicon Fringe Sample Metrology
Mr. Mark Kimball, Maxim Integrated
10:30 AM
8.4
A New De-Process Flow of Failure Analysis for MEMS Motion Sensor
Mr. Chun-An Huang, Taiwan, Integrated Service Technology Inc.
10:55 AM
8.5
TEM Sample Fabrication of Sub 22nm Three Dimensional Test Structures
Dr. James J. Demarest, IBM
11:20 AM
Open
12:00 PM
Lunch
1:30 PM
Poster Session and Dessert Reception
3:30 PM
8.7
Backside Sample Preparation Challenges for Fault Localization Analysis of Flip Chip Package
Dr. Lihong Cao, Advanced Micro Devices
3:55 PM
8.8
Direct Plan View FIB Liftout for Near-Surface Defect Analysis in TEM
Mr. Max L. Lifson, IBM; Mrs. Carla M. Chapman, IBM; Mr. D. Philip Pokrinchak, IBM; Ms. Phyllis J. Campbell, IBM; Mr. Greg S. Chrisman, IBM; Mr. Steven J. Boren, IBM; Dr. Renata A. Camillo-Castillo, IBM
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