14.3
Failure Analysis On Lifted Ball Bond and Micro Lateral Crack Using Fractography Approach
Failure Analysis On Lifted Ball Bond and Micro Lateral Crack Using Fractography Approach
Thursday, November 7, 2013: 3:50 PM
Meeting Room 230B (San Jose McEnery Convention Center)
Summary:
Fractography, deals with the interpretation of surface features, had been developed since years but till today it doesn’t lose its importance in failure analysis of semiconductor device. This paper demonstrates the application of fractography on ductile fracture in lifted gold wire ball bond and fractography on brittle fractures in micro lateral crack of silicon chip.
Fractography, deals with the interpretation of surface features, had been developed since years but till today it doesn’t lose its importance in failure analysis of semiconductor device. This paper demonstrates the application of fractography on ductile fracture in lifted gold wire ball bond and fractography on brittle fractures in micro lateral crack of silicon chip.