2.2
Sample Preparation Strategies for Fast and Effective Failure Analysis of 3D Devices
Sample Preparation Strategies for Fast and Effective Failure Analysis of 3D Devices
Monday, November 4, 2013: 1:30 PM
Meeting Room 230A (San Jose McEnery Convention Center)
Summary:
3D device Failure Analysis poses new challenges to the FA community as relatively large features have to be accessed and analyzed with nm resolution. For chip access and preparation of the Region of Interest, new tools have been introduced in recent years based on novel plasmaFIB and ns laser technologies.In this presentation the unique advantages of a combined Plasma-FIB and in-situ fs laser ablation or ex-situ atmospheric ns laser ablation workflow are presented. Speed and quality of the sample preparation are the key parameters that have been evaluated and that determine the effectiveness and applicability of the various sample preparation strategies.
3D device Failure Analysis poses new challenges to the FA community as relatively large features have to be accessed and analyzed with nm resolution. For chip access and preparation of the Region of Interest, new tools have been introduced in recent years based on novel plasmaFIB and ns laser technologies.In this presentation the unique advantages of a combined Plasma-FIB and in-situ fs laser ablation or ex-situ atmospheric ns laser ablation workflow are presented. Speed and quality of the sample preparation are the key parameters that have been evaluated and that determine the effectiveness and applicability of the various sample preparation strategies.