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Session 2: 3D Packages

Monday, November 4, 2013: 1:05 PM-2:45 PM
Meeting Room 230A (San Jose McEnery Convention Center)
Session Chairs:
Mr. Frank Altmann and Dr. Yan Li
1:05 PM
2.1
3D Void Imaging in Through Silicon Vias By X-Ray Nanotomography in An SEM
Mr. David Laloum, ST Microelectronics; Dr. Pierre Bleuet, CEA, LETI, MINATEC Campus; Dr. Frederic Lorut, ST Microelectronics; Dr. Guillaume Audoit, CEA, LETI, MINATEC Campus; Ms. Celine Ribiere, CEA, LETI, MINATEC Campus
1:30 PM
2.2
Sample Preparation Strategies for Fast and Effective Failure Analysis of 3D Devices
Mr. Laurens Kwakman, FEI Europe B.V.; Marcus Straw, FEI company; Gaelle Coustillier, LP3 Laboratory, Aix-Marseille University - CNRS; Marc Sentis, LP3 Laboratory, Aix-Marseille University - CNRS; Jan Schischka, Fraunhofer Institute for Mechanics of Materials; Jens Beyersdorfer, Fraunhofer Institute for Mechanics of Materials; Mr. Frank Altmann, Fraunhofer Institute for Mechanics of Materials
1:55 PM
2.3
Fast and Precise 3D Tomography of TSV By Using Xe Plasma FIB
Dr. Tomas Hrncir, TESCAN, a.s.; Mr. Lukas Hladik, TESCAN, a.s.
2:20 PM
2.4
Challenges for Physical Failure Analysis of 3D-Integrated Devices - Sample Preparation and Analysis to Support Process Development of Tsvs
Dr. Andreas Meyer, Globalfoundries Dresden
2:45 PM
Break
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