10
Session 10: Posters

Monday, November 4, 2013: 7:00 PM-9:30 PM
The Tech Museum
Wednesday, November 6, 2013: 1:30 PM-3:30 PM
Exhibit Hall 3 (San Jose McEnery Convention Center)
Session Chairs:
Mr. David Grosjean and Mr. Christian Burmer
10.1
Silicon Junction Profile Delineation By Anodic Etching in HF/HNO3/CH3COOH Solution
Dr. Jeng Han Lee, Taiwan
10.2
Localization of a Complex RF SOC Failure By Combining ATPG and Application Testing
Dr. Kai Wang, CSR plc
10.3
Gate Bridge to Drain Contact Characteristic in Floating Gate Memory
Mr. Pei Wei Chiang, Macronix International Co., LTD.; Ms. Yu Ting Ling, Macronix International Co., LTD.; Mr. Bo Chih Chen, Macronix International Co., LTD.; Mr. Hsiao Tien Chang, Macronix International Co., LTD.; Mr. Shih Chieh Chen, Macronix International Co., LTD.
10.4
Surface Treatment for 20nm SRAM Devices to Overcome Tip Curvature Radius Limitation in Conductive AFM Analysis
Dr. Tsu Hau Ng, Globalfoundries Singapore Pte. Ltd.; Ms. Sabitha James, Globalfoundries Singapore Pte. Ltd.; Dr. M. K. Dawood, Globalfoundries Singapore Pte. Ltd.; Mr. Pariyarathu Salimon Limin, Globalfoundries Singapore Pte. Ltd.; H Tan, Globalfoundries Singapore Pte. Ltd.; Mr. P.K. Tan, Globalfoundries Singapore Pte. Ltd.; Jeffrey Lam, Globalfoundries Singapore Pte. Ltd.; Dr. Z.H. Mai, Globalfoundries Singapore Pte. Ltd.
10.5
Micro-Abrasive Blasting: A Novel Approach to Local Silicon and Mold Compound Material Removal
Mr. Matthew M. Mulholland, Intel Corporation; Mr. Hien Nguyen, Intel Corporation
10.6
Die Level Defect Analysis Using Combined Techniques of AFP with Electron Microscopes
Ms. Lan Yin Lee, Xilinx Asia Pacific Pte Ltd; Haonan Bai, Xilinx Asia Pacific Pte Ltd; Chua Kok Keng, Xilinx Asia Pacific Pte Ltd; Chow Yew Meng, Xilinx Asia Pacific Pte Ltd; Grace Tan, Xilinx Asia Pacific Pte Ltd; Mr. Daniel Nuez, Xilinx; Mr. Douglas Hamilton, Xilinx
10.7
Study of Static Noise Margin and Circuit Analysis On Advanced Technology Node SRAM Devices By Nanoprobing
Dr. Tsu Hau Ng, Globalfoundries Singapore Pte. Ltd.; Dr. M.K. Dawood, Globalfoundries Singapore Pte. Ltd.; Mr. P.K. Tan, Globalfoundries Singapore Pte. Ltd.; H. Tan, Globalfoundries Singapore Pte. Ltd.; Ms. Sabitha James, Globalfoundries Singapore Pte. Ltd.; Mr. Pariyarathu Salimon Limin, Globalfoundries Singapore Pte. Ltd.; Dr. Yamin Huang, Globalfoundries Singapore Pte. Ltd.; Jeffrey Lam, Globalfoundries Singapore Pte. Ltd.; Dr. Z.H. Mai, Globalfoundries Singapore Pte. Ltd.
10.8
Validity-Study of Pind Test Put in the Screening Test for Cavity Devices for Space Application
Mr. Yusuke Nakatake, RYOEI TECHNICA CORPORATION
10.9
Advanced CMOS Device Fault Isolation Using Frequency Mapping On Passive Structures
Dr. SH Goh, GLOBALFOUNDRIES
10.10
UV-Raman Microscopy On the Analysis of Ultra-Low-k Dielectric Materials On Patterned Wafers
Mr. Jianhua Yin, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Yamin Huang, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Tsu Hau Ng, Globalfoundries Singapore Pte. Ltd.; H Tan, Globalfoundries Singapore Pte. Ltd.; Dr. M. K. Dawood, Globalfoundries Singapore Pte. Ltd.; Mr. P.K. Tan, Globalfoundries Singapore Pte. Ltd.; Jeffrey Lam, Globalfoundries Singapore Pte. Ltd.; Dr. Z.H. Mai, Globalfoundries Singapore Pte. Ltd.
10.11
A New Approach for Screening Retention Time Fail Bits in DRAM Device
Mr. Bonggu Sung, Samsung Electronics
10.12
Simple and Effective Technique of Backside De-Processing of Thin Flip Chip Package
Mr. Suk Ho Lee, Samsung Electronics co. Ltd; Mr. Chan Hee Park, Samsung Electronics co. Ltd; Mr. Seung Joon Cha, Samsung Electronics co. Ltd; Mr. Eun Cheol Lee, Samsung Electronics co. Ltd; Dr. Kyu Shik Hong, Samsung Electronics co. Ltd
10.13
Failure Localization of An Electrical Transient Behavior On a Mixed-Mode IC By Using Static Emission Microscopy Technique
Ms. Magdalena Anna Sienkiewicz, Freescale Semiconductor; Ms. Estelle Huynh, Freescale Semiconductor; Mr. Alain Vidal, Freescale Semiconductor; Mr. Philippe Rousseille, Freescale Semiconducteurs France SAS, Toulouse
10.14
A Reduction of Off-Leakage Current of SWD (Sub-WordLine Driver) Pmosfet for Nwl-Based Mobile DRAM
Mr. Sanghyeon Jeon, Samsung electronics Co. Ltd; Mr. Taehong Ha, Samsung electronics Co. Ltd; Mr. Youngwoo Kim, Samsung electronics Co. Ltd; Mr. Hyuckchai Jung, Samsung electronics Co. Ltd; Mr. Taewoo Lee, Samsung electronics Co. Ltd; Dr. Kyupil Lee, Samsung electronics Co. Ltd; Mr. Insoo Cho, Samsung electronics Co. Ltd
10.15
Adaptive Optics Compensation On Sample Thickness Error Induced Aberration in Asil Confocal Scanning Microscopy
Mr. Yang Lu, Boston University
10.16
Enabling Scanning Acoustic Microscopy Inspection of Materials Underneath the Chamfer of the Package
Ms. Melanie S. Cajita, Analog Devices, Inc - Gen Trias; Rudolf A. Sia, Analog Devices Inc.; Mrs. Marlyn C Grancapal, Analog Devices, Inc - Gen Trias
10.17
High Resolution C-Mode Scanning Acoustic Microscope Techniques for the Failure Analysis of Microelectronic Packages
Dr. Yan Li, Intel; Liang Hu, Intel; Gang Li, Intel; Rajen C Dias, Intel; Deepak Goyal, Intel
10.18
Memory Scramble Varification By Frontside and Backside FIB Modification
Mr. Chun Ming Tsai, United Microelectronics Corporation, Ltd.
10.19
Glass Interposer Reliability Improvement By Transient Thermal Modelling and Physical Analysis
Dr. Mohsine Bouya, Université Internationale de Rabat; Mr. Abderrahim El Amrani, Uinversité Internationale de Rabat; Mr. Abdellah Benali, Université Internationale de Rabat; Dr. Mustapha Faqir, Université Internationale de Rabat; Mr. Yassine Bouissa, Université Internationale de Rabat; Youssef Benlahoussine, Université Internationale de Rabat; Mr. Zouhir Sbiaa, Université Internationale de Rabat; Dr. Mounir Ghogho, Université Internationale de Rabat
10.20
How to Interpret the Reflected Laser Probe Signal of Multiple Elementary Substructures in Very Deep Submicron Technologies
Mr. Mehdi M Rebai, CNES
10.21
Rapid Failure Analysis of Low-Yielding Electrical Test Structures Using E-Beam Physical and Voltage Contrast Inspection
Dr. Oliver D. Patterson, IBM Systems & Technology; Mr. Shuen Cheng Chris Lei, Hermes Microvision Inc; Mr. Xiaohu Tang, Hermes Microvision Inc; Ms. Deborah A. Ryan, IBM Systems & Technology
10.22
A Simple Technique for Removing the Entire Metallization Stack for Sub 100nm Device Technologies
Mr. Randal E. Mulder, Silicon Labs; Mr. Robert Anderson, Silicon Labs
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