9.1
Laser Voltage Imaging and Its Derivatives, Efficient Techniques to Address Defect On 28nm Technology

Wednesday, November 6, 2013: 9:00 AM
Meeting Room 230B (San Jose McEnery Convention Center)
Mr. Thierry Parrassin , ST Microelectronics, Crolles, France
Mr. Guillaume Celi , ST Microelectronics, Crolles, France
Dr. Antoine Reverdy , Sector Technologies, Gières, France
Sylvain Dudit , ST Microelectronics, Crolles, France
Michel Vallet , ST Microelectronics, Crolles, France
Dr. Philippe Perdu , Centre National d'Etudes Spatiales (CNES), Toulouse, France
Prof. Dean Lewis , IMS laboratory, University of Bordeaux, Talence, France

Summary:

The Laser Voltage Imaging (LVI) technique, introduced in 2009, has been demonstrated as a successful defect localization technique to address problems on advanced technologies. In this paper, we describe several 28nm case studies on which LVI technique and its derivatives provide a real added value to the defect localization part of Failure Analysis flow. We will show that LVI images can be used as a great reference to improve the CAD alignment overlay accuracy which is critical for advanced technology debug. Then, we will introduce several case studies on 28nm technology on which Thermal Frequency Imaging (TFI) and Second Harmonic Detection (Two LVI derivative techniques) allow efficient defect localization.