4.3
Silicon & Package Preparation Options for Focused Ion Beam (FIB) Circuit Editing & General Packaging Failure Analysis
Silicon & Package Preparation Options for Focused Ion Beam (FIB) Circuit Editing & General Packaging Failure Analysis
Monday, November 4, 2013: 3:50 PM
Meeting Room 230A (San Jose McEnery Convention Center)
Summary:
An unusual synergy: Changes in chip & packaging are driving continuous development in backside FIB Chip Edit. We have been able to apply much of our silicon and package machining skills to greatly aid the 3D Package development effort.
An unusual synergy: Changes in chip & packaging are driving continuous development in backside FIB Chip Edit. We have been able to apply much of our silicon and package machining skills to greatly aid the 3D Package development effort.