Enabling Scanning Acoustic Microscopy Inspection of Materials Underneath the Chamfer of the Package

Summary:

This paper will discuss the process established to enable scanning acoustic microscopy inspection of materials underneath the chamfer of the package. A process step in determining the areas of affected by the chamfer non-destructively using a Copper tape (used for SEM inspection) was vital for the success of the succeeding steps. The process established will allow further electrical testing & verification of the units.