6.3
Nondestructive Analysis Solution Using Combination of Lock-in Thermography(LIT) and Advanced 3D Oblique X-Ray CT Technology

Tuesday, November 5, 2013: 10:20 AM
Meeting Room 230B (San Jose McEnery Convention Center)
Mr. Naoki Seimiya , Marubun Corporation, Chuo-ku, Tokyo, Japan

Summary:

I will introduce case example of non-destructive failure analysis using by the combination of Lock-in Thermography and advanced 3D-obleque X-ray CT.
See more of: Session 6: Packaging and Assembly Analysis - 1
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