High Resolution C-Mode Scanning Acoustic Microscope Techniques for the Failure Analysis of Microelectronic Packages

Summary:

Fault isolation and failure analysis in microelectronic packages usually takes days or weeks depending on the complication of the structure. To reduce the Throughput Time (TPT), nondestructive and high resolution imaging tools are desired to directly image the defects causing the failures. This paper presents some novel C-mode Scanning Acoustic Microscope (CSAM) techniques developed for nondestructively detecting subtle defects in microelectronic packages.